CELEBRATING 30 YEARS OF EXCELLENCE IN THE DEFENSE AND COMMERCIAL COMMUNICATIONS INDUSTRY
*The 90 durometer resilient pad is used for 1.25mm, small form factor (LC, MU, MT-RJ) connectors.
These polishing pads are used in accordance with MIL-STD-2042C to accomplish a domed endface polish.
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WidgCo BackPack and KSE Kit TFOCA II®
WidgCo BackPack and KSE Kit Expanded Beam
Portable OTDR, Cleaning and Inspection Backpack Kit
Pigtail Consumable Replacement Kit
Universal Splice Kit and Termination/Fusion Splice Kit
Military/Commercial Termination Kit
Military/Commercial Inspection, Cleaning, and Test Kit